Semiconductors have been getting smaller and smaller till now using innovative new technologies for their fabrication. Existing optical technology based lithographic processes, however, might not be effective beyond the 22 nanometer node. New technologies will be required to continue the trend of ever smaller semiconductors and computing devices.
Extreme ultraviolet technology has been discussed as one alternative to the above problem. However, 15 years of research into this technology has not delivered a production-ready process.
It is in this context that Leti’s Lithography laboratory in Grenoble, France is exploring alternatives. Leti is an applied research center for microelectronics and information and healthcare technologies. It is located at MINATEC, the micro and nanotechnologies innovation campus in Grenoble.
Leti provides an interface between industry and academic research, transferring innovative technologies into a wide range of sectors. With 1500 employees and more than 250 students conducting research in its laboratories, it has created a portfolio of 1500 families of patents. The laboratory has one of the most advanced equipment sets in the world, including two shaped e-beam systems, two Gaussian-beam systems, and the alpha version of Mapper Lithography’s multi-beam tool.
One of the technologies Leti is focusing now is fully depleted silicon-on-insulator (FDSOI) technology that can lead to fabrication of smaller, denser and faster integrated circuits.
Read about Leti at their website and the story about their plans to highlight FDSOI and 3D technologies at SEMICON Europa at Nanotechnology Now.
